Categories: Business

Besi shares fall on report ASML is working on rival hybrid bonding product

AMSTERDAM, Oct 16 (Reuters) – Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported

(The article has been published through a syndicated feed. Except for the headline, the content has been published verbatim. Liability lies with original publisher.)

Indianews Syndication

Recent Posts

Factbox-Weight-loss drug developers line up to tap lucrative market as competition heats up

Oct 16 (Reuters) - The weight-loss drug market is booming, with biotech firms racing to…

2 minutes ago

Besi shares fall on report ASML is working on rival hybrid bonding product

AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries…

3 minutes ago

China's cabinet calls for curbing disorderly price competition

BEIJING, Oct 16 (Reuters) - The State Council, China's cabinet, called for efforts to regulate…

9 minutes ago

Sungjae Im takes control of Macao Open

VIDEO SHOWS: HIGHLIGHTS FROM ROUND TWO OF THE ASIAN TOUR'S MACAO OPEN COMPLETE SHOTLIST AND…

10 minutes ago

European stocks rise, dollar set for weekly loss after yields drop

By Elizabeth Howcroft PARIS, Oct 16 (Reuters) - European stocks rose on Friday as markets…

13 minutes ago

Google's Waymo plans first Canada robotaxi service in Toronto in 2028

Oct 16 (Reuters) - Google's Waymo said on Friday it plans to bring its autonomous…

15 minutes ago